Memorie RAM Kingston FURY Beast, 32GB DDR4, 3200MHz, CL16

SKU: KF432C16BBK4/32

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Description

Memorie RAM Kingston,DDR4,32GB,3200Mhz,CL16,FURY Beast Kit of 4

Specification

Overview

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

Processor

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

Display

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

RAM

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

Storage

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

Video Card

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

Connectivity

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

Features

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

Battery

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

General

ECCNo
Cooling typeHeatsink
Component forPC
Products per master (outer) case10 pc(s)
Internal memory32 GB
KitDa
Recomandat pt gamingDa
RadiatorDa
Kit dual channelNu
Iluminare ledNu
Tip:DDR4
Capacitate32 GB
Latenta13 – 16 CL
Frecventa3200 MHz
Internal memory typeDDR4
Memory form factor288-pin DIMM
CAS latency16
Memory data transfer rate3200 MT/s
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
Intel Extreme Memory Profile (XMP)2.0
Programming power voltage (VPP)2.5 V
Lead platingGold
Tensiune alimentare1.2 V
Memory voltage1.2 V
Master (outer) case width203.2 mm
Master (outer) case height101.6 mm
Memory clock speed1600 MHz
Kit quad channelDa
Master (outer) case length311.1 mm
Module configuration1024M x 64
Memory layout (modules x size)4 x 8 GB
DRAM-Capacity32GB
DRAM-TypeDDR4
DRAM-Frequency3200MHz
Master (outer) case gross weight2.12 kg
Operating temperature (T-T)0 – 85 °C
Height34.1 mm
Harmonized System (HS) code84733020
Country of originChina, Taiwan
Storage temperature (T-T)-55 – 100 °C
Depth133.3 mm
Package height171.4 mm
Weight136.68 g
Package width95.2 mm
Package weight191.22 g
Width72 mm
Package depth254 mm
ProducatorKINGSTON
Garantie999

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